a reactive etch solution composed of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) to remove organic contaminants from a silicon wafer or a film such as SiO2. [SEMATECH]
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a reactive etch solution composed of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) to remove organic contaminants from a silicon wafer or a film such as SiO2. [SEMATECH]