on a wafer, surface irregularities in the form of a series of alternating ridges and depressions in arcs, the radii of which are the same as those of the saw blade used for slicing. [ASTM F1241] Also see saw exit mark.
on a wafer, surface irregularities in the form of a series of alternating ridges and depressions in arcs, the radii of which are the same as those of the saw blade used for slicing. [ASTM F1241] Also see saw exit mark.