Definition of wafer bumping

1. the process by which contact points on a wafer are heightened above the wafer surface by adding conductor material. These contact bumps are bonded or fused to make all required electrical connections to tape, packages, or other interconnection substrates in a single process step. Bumps may be provided on the die edges or distributed over the surface of the die in an area array. [1994 National Technology Roadmap for Semiconductors]