1 : in a cofired ceramic semiconductor package, the area that is designated for die attach. The nominal area is defined by the limits of the bond finger ledge (or wire bond cavity). [SEMATECH] Also see effective die attach area . 2 : the overall area for wire bonds in a cofired ceramic package. [SEMATECH] 3 : in a mold for plastic packages, the areas of the mold that become filled with plastic during the molding cycle, encapsulate the die, and form the body of the device. A mold has matching upper and lower cavities, and the term cavity is also used to describe the top or bottom of a finished plastic package. [SEMATECH] 4 : a vacancy or empty space in a wafer. A cavity usually is left by dissolved precipitates or gallium inclusions or by arsenic dissociation, or it may be created by excessive vapor pressure. [SEMI M10-89] 5 : in pellicle technology, an unfilled space between the photomask and the optically transparent film within the mounted pellicle frame area. [SEMI P5-86]
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