1 : in semiconductor wafers, a region where material has been unintentionally removed from the surface or edge of the wafer. [ASTM F1241] Contrast indent. 2 : see die. 3 : in packaging, a region of material missing from a component; for example, ceramic from a package or solder from a preform. The region does not progress completely through the component and is formed after the component is manufactured. The chip size is given by its length, width, and depth from a projection of the design plan-form. [SEMI G61-94] Also called chip-out. Contrast pit. 4 : in flat panel display substrates, a region of material missing from the edge of the glass substrate, which is sometimes caused by breakage or handling. [SEMI D9-94]
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