on semiconductor wafers, a shallow groove or cut below the established plane of the surface, with a length to width ratio greater than 5:1. [ASTM F1241] Also see macroscratch and microscratch.
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on semiconductor wafers, a shallow groove or cut below the established plane of the surface, with a length to width ratio greater than 5:1. [ASTM F1241] Also see macroscratch and microscratch.